The Summit X670 series includes the following switches:
Note
The 17103C Teradyne X670-48x-FB-AC consists of one (17103) X670-48x 48 10GBASE-X SFP+ with three front-to-back airflow fan modules and two (10925) 550W AC Power Supplies with front-to-back airflow.Note
For the technical specifications of power supplies for the Summit X670 series switches, see Summit 450 W Power Supplies Technical Specifications and Summit 550 W Power Supplies Technical Specifications.
Summit X670-48x switch Summit X670V-48x switch Summit X670V-48t switch |
Height: 1.73 inches (4.4 cm) Width: 17.4 inches (44.1 cm) Depth: 19.25 inches (48.9 cm) |
VIM4-40G4X module |
Height: 1.6 inches (4.1 cm) Width: 4.1 inches (10.3 cm) Depth: 6.5 inches (16.6 cm) |
Summit X670 fan module |
Height: 1.65 inches (4.2 cm) Width: 1.65 inches (4.2 cm) Depth: 3.98 inches (10.1 cm) |
Summit X670-48x switch |
16.0 lb (7.3 kg) |
Summit X670V-48x switch Summit X670V-48t switch |
15.3 lb (7.0 kg) |
Note: Switch weights include
installed fan module. They do not include installed VIM4 modules
or power supplies.
|
|
VIM4-40G4X module |
0.99 lb (0.45 kg) |
Summit X670 fan module |
0.36 lb (0.16 kg) |
Summit X670-48x switch Summit X670V-48x switch Summit X670V-48t switch |
Height: 6.5 inches (16.5 cm) |
Width: 23.4 inches (59.3 cm) |
|
Depth: 26.2 inches (66.5 cm) |
|
VVIM4-40G4X module |
Height: 3.9 inches (10 cm) |
Width: 9.4 inches (24.0 cm) |
|
Depth: 15.4 inches (39 cm) |
Summit X670-48x switch |
22.7 lb (10.3 kg) |
Summit X670V-48x switch Summit X670V-48t switch |
21.2 lb (9.6 kg) |
VIM4-40G4X module |
2.75 lb (1.25 kg) |
Summit X670 fan module |
1.27 lb (0.58 kg) |
Minimum speed |
4500 RPM |
Maximum speed |
18000 RPM |
Nominal input ratings |
100 to 240 V, 50/60 Hz, 2.5 A |
Input current |
2.25 A @ 100 V (low-line) 0.9 A @ 240 V (high-line) |
Heat dissipation |
225 W, 768 BTU/hr |
Power consumption |
225 W, 768 BTU/hr |
Nominal input ratings |
48 to 60 V, 5.0 A |
Input current |
4.25 A @ 48 V (low-line) 3.35 A @ 60 V (high-line) |
Heat dissipation |
210 W, 717 BTU/hr |
Power consumption |
210 W, 717 BTU/hr |
Nominal input ratings |
100 to 240 V, 50/60 Hz, 3.75 A |
Input current |
3.0 A @ 100 V (low-line) 1.2 A @ 240 V (high-line) |
Heat dissipation |
300 W, 1,024 BTU/hr |
Power consumption |
300 W, 1,024 BTU/hr |
Nominal input ratings |
100 to 240 V, 50/60 Hz, 3.75 A |
Input current |
3.4 A @ 100 V (low-line) 1.4 A @ 240 V (high-line) |
Heat dissipation |
340 W, 1,161 BTU/hr |
Power consumption |
340 W, 1,161 BTU/hr |
Nominal input ratings |
48 to 60 V, 7.5 A |
Input current |
5.7 A @ 48 V (low-line) 4.6 A @ 60 V (high-line) |
Heat dissipation |
280 W, 956 BTU/hr |
Power consumption |
280 W, 956 BTU/hr |
Nominal input ratings |
48 to 60 V, 7.5 A |
Input current |
6.85 A @ 48 V (low-line) 5.45 A @ 60 V (high-line) |
Heat dissipation |
330 W, 1,126 BTU/hr |
Power consumption |
330 W, 1,126 BTU/hr |
Nominal input ratings |
100 to 240 V, 50/60 Hz, 4.0 A |
Input current |
3.3 A @ 100 V (low-line) 1.41 A @ 240 V (high-line) |
Heat dissipation |
323 W, 1,102 BTU/hr |
Power consumption |
323 W, 1,102 BTU/hr |
Nominal input ratings |
100 to 240 V, 50/60 Hz, 4.0 A |
Input current |
3.5 A @ 100 V (low-line) 1.52 A @ 230 V (high-line) |
Heat dissipation |
350 W, 1,194 BTU/hr |
Power consumption |
350 W, 1,194 BTU/hr |
Nominal input ratings |
48 to 60 V, 7.5 A |
Input current |
8.4 A @ 40 V (low-line) 5.4 A @ 60 V (high-line) |
Heat dissipation |
336 W, 1147 BTU/hr |
Power consumption |
336 W, 1147 BTU/hr |
Nominal input ratings |
48 to 60 V, 8.0 A |
Input current |
9.13 A @ 48 V (low-line) 5.88 A @ 60 V (high-line) |
Heat dissipation |
365W, 1,245 BTU/hr |
Power consumption |
365 W, 1,245 BTU/hr |
1 GHz CPU |
1 GB memory |
9 MB buffer, per chip |
North American Safety of ITE |
UL 60950-1 1st Ed., Listed Device (US) CSA 22.2 #60950-1-07 2nd Ed.(Canada) Complies with FCC 21CFR 1040.10 (US Laser Safety) CDRH Letter of Approval (US FDA Approval) |
European Safety of ITE |
EN 60950-1:2006 2nd Ed. TUV-R GS EN 60825-1:2007 (Lasers Safety) 2006/95/EC Low Voltage Directive |
International Safety of ITE |
CB Report & Certificate per IEC 60950-1:2005 2nd Ed., + National Differences AS/NZX 60950-1 (Australia /New Zealand) |
North America EMC for ITE |
FCC CFR 47 part 15 Class A (USA) ICES-003 Class A (Canada) |
European EMC standards |
EN 55022:2006+A1:2007 Class A EN 55024:1998+A1:2001+A2:2003 Class A includes IEC 61000-4-2, 3, 4, 5, 6, 11 EN 61000-3-2: 2006+A2:2009 (Harmonics) EN 61000-3-3:2008 (Flicker) ETSI EN 300 386: v1.4.1 (2008-04) (EMC Telecommunications) 2004/108/EC EMC Directive |
International EMC certifications |
CISPR 22: 2008 (Ed 6.0), Class A (International Emissions) EN 55024:1998+A1:2001+A2:2003 Class A (International Immunity) IEC/EN 61000-4-2:2008 Electrostatic Discharge, 8kV Contact, 15 kV Air, Criteria A IEC/EN 61000-4-3:2008 Radiated Immunity 10V/m, Criteria IEC/EN 61000-4-4:2004 Transient Burst, 1 kV, Criteria A IEC/EN 61000-4-5:2005 Surge, 2 kV L-L, 2 kV L-G, Level 3, Criteria A IEC/EN 61000-4-6:2008 Conducted Immunity, 0.15-80 MHz, 10V/m unmod. RMS, Criteria A IEC/EN 61000-4-11:2004 Power Dips & Interruptions, >30%, 25 periods, Criteria C |
Country-specific |
VCCI Class A (Japan Emissions) BSMI (Taiwan Emissions) ACMA (C-Tick) (Australia Emissions) CCC Mark (China) KCC Mark, EMC Approval (Korea) |
EN/ETSI 300 386:2008 (EMC Telecommunications) EN/ETSI 300 019 (Environmental for Telecommunications) MEF9 and MEF14 certified for EPL, EVPL, and ELAN |
IEEE 802.3ab 1000BASE-T IEEE 802.3z 1000BASE-X IEEE 802.3ae 10GBASE-X IEEE 802.3ba 40GBASE-X |
Environmental standards |
EN/ETSI 300 019-2-1 v2.1.2 (2000 - 2009) - Class 1.2 Storage EN/ETSI 300 019-2-2 v2.1.2 (1999 - 09) - Class 2.3 Transportation EN/ETSI 300 019-2-3 v2.1.2 (2003 - 04) - Class 3.1e Operational EN/ETSI 300 753 (1997-10) - Acoustic Noise ASTM D3580 Random Vibration Unpackaged 1.5G |
Operating conditions |
Temperature range: 0° C to 45° C (32° F to 113° F) Humidity: 10% to 95% relative humidity, non-condensing Altitude: 0 to 3,000 meters (9,850 feet) Operational shock (half sine): 30 m/s2 (3 G), 11 ms, 60 shocks Operational random vibration: 3 to 500 Hz at 1.5 G rms |
Storage & transportation conditions (packaged) |
Transportation temperature: -40° C to 70° C (-40° F to 158° F) Storage and transportation humidity: 10% to 95% relative humidity, non-condensing Packaged shock (half sine): 180 m/s2 (18 G), 6 ms, 600 shocks Packaged sine vibration: 5 to 62 Hz at velocity 5 mm/s, 62 to 500 Hz at 0.2 G Packaged random vibration: 5 to 20 Hz at 1.0 ASD w/–3 dB/oct. from 20 to 200 Hz 14 drops minimum on sides and corners at 42 inches (<15 kg box) |
Acoustic noise | Summit X670V-48x: 56.6 dB(A) min |