The Summit X770 series includes the following switch:
| Summit X770-32q switch |
Height: 1.73 inches (4.4 cm) Width: 17.6 inches (44.8 cm) Depth: 20.4 inches (51.9 cm) including the PSU and installed fan modules. |
| Summit X770-32q switch | 18.0 lb (8.2 kg) |
| Summit X770 fan module | 0.36 lb (0.16 kg) |
| 550 W AC PSU | 2.75 lb (1.2 kg) |
| 550 W DC PSU | 2.50 lb (1.1 kg) |
| Summit X770-32q switch | Height: 6.5 inches (16.5 cm) |
| Width: 23.4 inches (59.3 cm) | |
| Depth: 26.2 inches (66.5 cm) |
| Summit X770-32q switch | 23.2 lb (10.5 kg) |
| Summit X770 fan module | 0.50 lb (0.20 kg) |
| Minimum speed | 4500 RPM |
| Maximum speed | 18000 RPM |
| Nominal input ratings | 100 to 240 V , 50/60 Hz, 2.5 A |
| Input current |
2.25 A @ 100 V 0.9 A @ 240 V |
| Heat dissipation | 225 W, 768 BTU/hr |
| Power consumption | 225 W, 768 BTU/hr |
| Nominal input ratings | 48 to 60 V , 5.0 A |
| Input current |
4.25 A @ 48 V 3.35 A @ 60 V |
| Heat dissipation | 210 W, 717 BTU/hr |
| Power consumption | 210 W, 717 BTU/hr |
| Configuration No. | Quantity PSU | PSU Part No. | Power Supply Description | Quantity Fan Tray | Fan Tray Part No. | Fan Tray Description |
|---|---|---|---|---|---|---|
| 1 | 1 | 10927z | Summit 550 W AC PSU Back to Front airflow (DS550HE-3) | 5 | 17112z | Summit X670 fan module Back to Front airflow (JDD0405612UB3A01) |
| 2 | 1 | 10925z | Summit 550 W AC PSU Front to Back airflow (DS550HE-3) | 5 | 17111z | Summit X670 fan module Front to Back airflow (AS04012UB565300) |
| 3 | 2 | 10927z | Summit 550 W AC PSU Back to Front airflow (DS550HE-3) | 5 | 17112z | Summit X670 fan module Back to Front airflow (JDD0405612UB3A01) |
| 4 | 2 | 10925z | Summit 550 W AC PSU Front to Back airflow (DS550HE-3) | 5 | 17111z | Summit X670 fan module Front to Back airflow (AS04012UB565300) |
| 5 | 1 | 10928z | Summit 550 W DC PSU Back to Front airflow (DS550DC-3-003) | 5 | 17112z | Summit X670 fan module Back to Front airflow (JDD0405612UB3A01) |
| 6 | 1 | 10926z | Summit 550 W DC PSU Front to Back airflow (DS550DC-3) | 5 | 17111z | Summit X670 fan module Front to Back airflow (AS04012UB565300) |
| 7 | 2 | 10928z | Summit 550 W DC PSU Back to Front airflow (DS550DC-3-003) | 5 | 17112z | Summit X670 fan module Back to Front airflow (JDD0405612UB3A01) |
| 8 | 2 | 10926z | Summit 550 W DC PSU Front to Back airflow (DS550DC-3) | 5 | 17111z | Summit X670 fan module Front to Back airflow (AS04012UB565300) |
| 9 | 1 | 10927z | Summit 550 W AC PSU Back to Front airflow (DS550HE-3) | 5 | 17112z | Summit X670 fan module Back to Front airflow (JDD0405612UB3A01) |
| 1 | 10928z | Summit 550 W DC PSU Back to Front airflow (DS550DC-3-003) | ||||
| 10 | 1 | 10925z | Summit 550 W AC PSU Front to Back airflow (DS550HE-3) | 5 | 17111z | Summit X670 fan module Front to Back airflow (AS04012UB565300) |
| 1 | 10926z | Summit 550 W DC PSU Front to Back airflow (DS550DC-3 |
| 1GHz CPU |
| 1GB memory |
| 12 MB packet buffer, per chip |
| North American Safety of ITE |
UL 60950-1 1st Ed., Listed Device (US) CSA 22.2 #60950-1-07 2nd Ed.(Canada) Complies with FCC 21CFR 1040.10 (US Laser Safety) CDRH Letter of Approval (US FDA Approval) |
| European Safety of ITE |
EN 60950-1:2006 2nd Ed. TUV-R GS EN 60825-1:2007 (Lasers Safety) 2006/95/EC Low Voltage Directive |
| International Safety of ITE |
CB Report & Certificate per IEC 60950-1:2005 2nd Ed., + National Differences AS/NZX 60950-1 (Australia /New Zealand) |
| North America EMC for ITE |
FCC CFR 47 part 15 Class A (USA) ICES-003 Class A (Canada) |
| European EMC standards |
EN 55022:2006+A1:2007 Class A EN 55024:1998+A1:2001+A2:2003 Class A includes IEC 61000-4-2, 3, 4, 5, 6, 11 EN 61000-3-2: 2006+A2:2009 (Harmonics) EN 61000-3-3:2008 (Flicker) ETSI EN 300 386: v1.4.1 (2008-04) (EMC Telecommunications) 2004/108/EC EMC Directive |
| International EMC certifications |
CISPR 22: 2008 (Ed 6.0), Class A (International Emissions) EN 55024:1998+A1:2001+A2:2003 Class A (International Immunity) IEC/EN 61000-4-2:2008 Electrostatic Discharge, 8kV Contact, 15 kV Air, Criteria A IEC/EN 61000-4-3:2008 Radiated Immunity 10V/m, Criteria IEC/EN 61000-4-4:2004 Transient Burst, 1 kV, Criteria A IEC/EN 61000-4-5:2005 Surge, 2 kV L-L, 2 kV L-G, Level 3, Criteria A IEC/EN 61000-4-6:2008 Conducted Immunity, 0.15-80 MHz, 10V/m unmod. RMS, Criteria A IEC/EN 61000-4-11:2004 Power Dips & Interruptions, >30%, 25 periods, Criteria C |
| Country-specific |
VCCI Class A (Japan Emissions) BSMI (Taiwan Emissions) ACMA (C-Tick) (Australia Emissions) CCC Mark (China) KCC Mark, EMC Approval (Korea) |
|
EN/ETSI 300 386:2008 (EMC Telecommunications) EN/ETSI 300 019 (Environmental for Telecommunications) MEF9 and MEF14 certified for EPL, EVPL, and ELAN |
|
IEEE 802.3ab 1000BASE-T IEEE 802.3z 1000BASE-X IEEE 802.3ae 10GBASE-X IEEE 802.3ba 40GBASE-X |
| Environmental standards |
EN/ETSI 300 019-2-1 v2.1.2 (2000 - 2009) - Class 1.2 Storage EN/ETSI 300 019-2-2 v2.1.2 (1999 - 09) - Class 2.3 Transportation EN/ETSI 300 019-2-3 v2.1.2 (2003 - 04) - Class 3.1e Operational EN/ETSI 300 753 (1997-10) - Acoustic Noise ASTM D3580 Random Vibration Unpackaged 1.5G |
| Operating conditions |
Temperature range: 0°C to 45°C (32°F to 113°F) Humidity: 10% to 95% relative humidity, non-condensing Altitude: 0 to 3,000 meters (9,850 feet) Operational shock (half sine): 30 m/s2 (3 G), 11 ms, 60 shocks Operational random vibration: 3 to 500 Hz at 1.5 G rms |
| Storage & transportation conditions (packaged) |
Transportation temperature: -40°C to 70°C (-40°F to 158°F) Storage and transportation humidity: 10% to 95% relative humidity, non-condensing Packaged shock (half sine): 180 m/s2 (18 G), 6 ms, 600 shocks Packaged sine vibration: 5 to 62 Hz at velocity 5 mm/s, 62 to 500 Hz at 0.2 G Packaged random vibration: 5 to 20 Hz at 1.0 ASD w/–3 dB/oct. from 20 to 200 Hz 14 drops minimum on sides and corners at 42 inches (<15 kg box) |
| Acoustic noise | Summit X770-32q: 56.6 dB(A) min |